POLYMERS FOR OPTICAL AND
MICROWAVE APPLICATIONS
Design, Fabrication, and Packaging Process
More courses related to
optical areas are listed below.
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DATES AND LOCATIONS |
February
18 and 19, 2010. Call for seminar’s location: 216-235-6770 |
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April
12 and 13, 2010. |
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June
3 and 4, 2010. August
16 and 17, 2010. October
7 and 8, 2010. December
6 and 7, 2010. |
ON-SITE TRAINING: For more information,
call at 216-235-6770.
Cost: $1,200.
Registration Contact: 216-235-6770
Today, literally hundreds of polymeric materials have found widespread use in the manufacture of microwave, electronic, and photonic systems . This is due in part to their structures that can be tailored to provide a wide range of physical properties, and also due to the ease of processing and fabrication of polymers.
This course presents some important applications of polymers in electronic and photonic applications. The course begins with an overview of polymer materials which includes in detail both advantages and disadvantages of polymers and comparison of polymers with other materials. It also presents the development of intrinsically conducting polymers that exhibit conductivities similar to metal. Following this, it explores the lithography processing techniques associated with the use of polymer materials such as processing conditions, photolithography methods, and patterning methods. Described in detail are the characteristics of polymer resists and issues of packaging and chip materials to illustrate the importance of polymer materials and processing in attaining VLSI devices in electronic applications. In addition, it addresses significant issues regarding nonlinear optical polymers and microwave loss in polymers, followed by a discussion of processing and fabrication techniques for integrated optical waveguides, an emerging technology for polymers in photonic applications. And finally, the course outlines recent advances in developments and applications of polymer based materials. BACK
Hung D. Nguyen, Ph.D.
Dr. Nguyen is a senior engineer for the Space Communication
Division of NASA Glenn Research Center at
Practicing scientists, engineers, managers, marketing/sale personnel, or technicians who desire either an introduction or overview/review of organic polymers for applications in RF microwave , electronics, and photonic systems. BACK
- Understand the practical and technical issues of organic polymers used in microelectronic and photonic device fabrication.
- Learn the recent developments and applications of polymer based devices.
- Understand the important aspects of mechanical, adhesive, and diffusive properties of polymers in electronic applications.
- Gain knowledge of the latest development in polymers for non-linear optics and integrated optical waveguides in photonic applications.
- Develop a basis for further research and development.
Overview of Polymer Materials
Types of polymer materials
Chemistry of Polymers
-Sythesis
-Polymerization
-Conductive
-Dielectric properties
Uses of polymer materials in industry
-Radiation-sensitive materials
-Dielectric materials
-Encapsulation materials
-Conducting materials
-Nonlinear optical materials
Advantages and disadvantage of polymer materials
Comparison of material systems
Processing of organic materials
Lithography Processing Techniques for Polymer Materials
Processing conditions
-Wafer preparation
Deposition and coating of polymer film
-Adhesion promoters
-Spin coating
-Spray coating
-Photolithography
-Proximity printing
-Contact printing
-Soft bake
Photolithography methods
-Electron-beam lithography
*Positive resist
*Negative resist
*X-ray lithography
Patterning methods
-Process of developments
-Isotropic etching
-Anisotropic etching
-Dry etching process
-Wet etching process
-Reactive ion etching process
*Non-erodible etch mask
*Erodible etch mask
-Lift-off process
-Photosensitive process
Issues of packaging and chip materials
Resist requirements
-Contrast, Sensitivity, Resolution, Etching resistance
Chemistry and processes associated with resists
-Positive resists
-Negative resists
-Multilevel resists
-UV resist
-E-beam resist
Polymers and other materials dielectrics
-Thermal properties
-Electric properties
*Frequency range, dielectric constant, dissipative factor, resistivity,
*voltage breakdown, loss, and power factor
-Mechanical properties
*Stress, adhesion strength
-Dielectric properties and high speed application
-Yields and reliability issues
Materials/Process choice
Adhesion of metal/polymer structures
-Polymer to substrates
-Polymer on metals
-Metal on polymers
*Cr/polymer interface
*Cu/Cr/polymer interface
-Polymer on polymers
Metal diffusion in polymers
-Cu/Polymer, Ti/Polymer
-Cr/Polymer, Ni/Polymer
Corrosion of multilayer metal structures
-Cr/cu interfaces
-Cr/Ni/Cu interfaces
Thermal stability of multilayer structures
Temperature requirements for integrated optic modules
Type of conductive polymers
Conductivities of various compounds
DC conductivity measurement
AC conductivity measurement
Protection layers
Intermetal dielectric layers
Nonphotosensitive polymer
Photosensitivity polymer
Nonlinear optic polymers
Type of guest-host polymers
Nonlinear optical properties
-Second-order harmonics
-Third-order harmonics
Electro-optic effects
Optical Kerr effect
Polarization effects
Molecular alignment
Poling of waveguides
-Corona discharge poling
-Contact poling
*Poling stability
*Electro-optic coefficient
*Thermal stability
*Optical stability
Microwave loss in polymers
Integrated optical waveguides
Polymer waveguide
-Injection molding process
-Wet chemical process
-Projection printing process
-Ultraviolet laser process
-Photobleaching process
-Reactive ion process
Loss mechanisms
Developments and Applications of Polymer Based Devices
Optical and electronic multi-chip structures
Optical interconnects
Mach-Zehnder interferometer modulators
Traveling wave electro-optic phase modulators
Directional mode couplers
Optical switchings
Mutiplexers and demultiplexer
Multilevel active structures
Y-junction hybrid couplers
Elevated waveguide for multilayer circuits
Mutimode star couplers
*Mix rod structure
*Symmetric tree structure
INFORMATION ON REGISTRATION.
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TIME : 8: 00 – 5:00 FEES : $1,200. 3-way of Payment: 1.Check payable to : Lightwave Technology Corp.
(Mail to: Lightwave Technology Corp., 2. Purchase order attached : # 3. Invoice my company: Attention : Seminar Location: To be announced. |
IN-HOUSE SEMINAR INFORMATION.
Date: 2 days
Time: 8:00 - 5:00
Maximum students per training
section: 20
Fees: $ 7,800. ( Fee includes travel expense and class
materials)
POLICY
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DEAD LINE REGISTRATION |
Registration by regular or electronic mail must be received at least 14
days before the first day of class (course date) |
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REFUND POLICY |
Full refund if class is cancelled. Otherwise, 20% refund less than 7 days
before the first day of class. No refund is granted the first day of class. |
Lightwave Technology Corp. reserves the right to cancel
class if there is inadequate enrollment.
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